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Major Investment in New Surface Mount Placement Equipment

Continued growth in PCB assembly, and in particular surface mount assembly, highlighted the need for faster, more efficient component placement.

A Samsung CP45 FV Neo with 6 placement heads and optical alignment system was installed providing placement speeds of up to 15,000 components per hour and offering the capability of accurately placing 0.5mm BGA's and component footprints down to 0201. This equipment compliments our already proven Samsung CP40V with 4 placement heads and further investment is intended in the near future with a flexible Samsung CP20V. This will standardise our SMT equipment platform providing greater flexibility and setups. In addition to this investment a Nutek automatic board loader and MPM Hi-e 2000 Stencil printer with 2D post paste inspection capabilities was installed to offer a fully automatic in-line process capability.